Sheet No.: DG-072011
11
GM5ZR96270A
?SPAN class="pst GM5ZR96270A_2655836_2">Soldering Instructions
1. When soldering with reflow methods, Sharp recommends following the soldering profile in Fig. 13.
2. Electrodes on this part are silver-plated. If the part is exposed to a corrosive environment, the plating may be
damaged, thereby affecting solderability.
3. Do not subject the package to excessive mechanical force during soldering as it may cause deformation or
defects in plated connections. Internal connections may be severed due to mechanical force placed on the pack-
age due to the PCB flexing during the soldering process.
4. Both PCB design and solder reflow machine specifications will affect the amount of heat conducted into this part
during the production process. Sharp recommends verifying the process before production begins.
5. When using backside dip methods, Sharp recommends giving careful consideration to the process, as board
warping from heat may occur and the heat itself may be conducted into the package. Reflow after dip is recom-
mended, but they can be performed in the opposite order; keep the interval between the two processes as short
as possible.
6. When using a second reflow, the second process should be carried out as soon as possible after the first, unless
there is a water-wash or solvent-wash process. Then the parts must be baked as specified in Storage and Han-
dling before performing the second reflow.
7. The Reflow Profile shown in Fig. 13 should be considered as a set of maximum parameters. Since this part uses
the leads for heatsinking, the peak temperature should be kept as cool as possible and the cooldown period
lengthened as much as possible. Thermal conduction into the LED will be affected by the performance of the
reflow process, so verification of the reflow process is recommended. These parts may be used in a nitrogen
reflow process.
Fig. 13 Temperature Profile
25
150
1 ~ 4癈/s
1 ~ 4癈/s
1 ~ 2.5癈/s
220
260 (MAX)
200
60 ~ 120s
5s (MAX)
60s (MAX)
相关PDF资料
GM5ZS03200Z LED SUNSET ORANGE CLEAR 6050 T/H
HLMPD150A LED ALGAAS HE RED DIFF LC 5MM
HLMPM201 LED SS HE RED DIFF FLAT TOP 4MM
MTE1074N1-R VISIBLE RED EMITTER 740NM 5MM
MTE1077M3A-R LED NEAR INFRARED EMITTER 770NM
MTE1077N1-R LED VISIBLE RED EMITTER 770NM
MTE2056M3A-UYG LED VISIBLE EMITTER 562NM
MTE2056N-UYG LED VISIBLE EMITTER 562NM
相关代理商/技术参数
GM5ZRB01210A 制造商:未知厂家 制造商全称:未知厂家 功能描述:HIGH-LUMINOSITY LED LAMP
GM5ZRG01210A 制造商:未知厂家 制造商全称:未知厂家 功能描述:HIGH-LUMINOSITY LED LAMP
GM5ZS01200A 功能描述:标准LED-SMD TAF LED 6.0x5.7x2.4 SORNG Supr Lumin RoHS:否 制造商:Vishay Semiconductors 封装 / 箱体:0402 LED 大小:1 mm x 0.5 mm x 0.35 mm 照明颜色:Red 波长/色温:631 nm 透镜颜色/类型:Water Clear 正向电流:30 mA 正向电压:2 V 光强度:54 mcd 显示角:130 deg 系列:VLMx1500 封装:Reel
GM5ZS03200Z 功能描述:标准LED-SMD TAF LED 6.0x6.0x2.65 SOrng Supr Lumnsty RoHS:否 制造商:Vishay Semiconductors 封装 / 箱体:0402 LED 大小:1 mm x 0.5 mm x 0.35 mm 照明颜色:Red 波长/色温:631 nm 透镜颜色/类型:Water Clear 正向电流:30 mA 正向电压:2 V 光强度:54 mcd 显示角:130 deg 系列:VLMx1500 封装:Reel
GM5ZV01200A 功能描述:标准LED-SMD TAF LED 6.0x5.7x2.4 Amber Supr Luminosty RoHS:否 制造商:Vishay Semiconductors 封装 / 箱体:0402 LED 大小:1 mm x 0.5 mm x 0.35 mm 照明颜色:Red 波长/色温:631 nm 透镜颜色/类型:Water Clear 正向电流:30 mA 正向电压:2 V 光强度:54 mcd 显示角:130 deg 系列:VLMx1500 封装:Reel
GM5ZV03200Z 功能描述:标准LED-SMD TAF LED 6.0x6.0x2.65 Red Super Luminosity RoHS:否 制造商:Vishay Semiconductors 封装 / 箱体:0402 LED 大小:1 mm x 0.5 mm x 0.35 mm 照明颜色:Red 波长/色温:631 nm 透镜颜色/类型:Water Clear 正向电流:30 mA 正向电压:2 V 光强度:54 mcd 显示角:130 deg 系列:VLMx1500 封装:Reel
GM5ZV96270A 功能描述:标准LED-SMD (Amber) RoHS:否 制造商:Vishay Semiconductors 封装 / 箱体:0402 LED 大小:1 mm x 0.5 mm x 0.35 mm 照明颜色:Red 波长/色温:631 nm 透镜颜色/类型:Water Clear 正向电流:30 mA 正向电压:2 V 光强度:54 mcd 显示角:130 deg 系列:VLMx1500 封装:Reel
GM60028H-CG 制造商:STMicroelectronics 功能描述:DISPLAYPORT TRANSMITTER IC